2016-E6E: Analog ICs: MMICs, CCDs, Device packages
Which of the following is true of a charge-coupled device (CCD)?
It samples an analog signal and passes it in stages from the input to the output
Its phase shift changes rapidly with frequency
It is a CMOS analog-to-digital converter
It is used in a battery charger circuit
Which of the following device packages is a through-hole type?
Ball grid array
Which of the following materials is likely to provide the highest frequency of operation when used in MMICs?
Which is the most common input and output impedance of circuits that use MMICs?
Which of the following noise figure values is typical of a low-noise UHF preamplifier?
What characteristics of the MMIC make it a popular choice for VHF through microwave circuits?
Controlled gain, low noise figure, and constant input and output impedance over the specified frequency range
The ability to retrieve information from a single signal even in the presence of other strong signals
Plate current that is controlled by a control grid
Nearly infinite gain, very high input impedance, and very low output impedance
Which of the following is typically used to construct a MMIC-based microwave amplifier?
How is voltage from a power supply normally furnished to the most common type of monolithic microwave integrated circuit (MMIC)?
Through a resistor and/or RF choke connected to the amplifier output lead
MMICs require no operating bias
Through a capacitor and RF choke connected to the amplifier input lead
Directly to the bias voltage (VCC IN) lead
Which of the following component package types would be most suitable for use at frequencies above the HF range?
What is the packaging technique in which leadless components are soldered directly to circuit boards?
Virtual lead mounting
What is a characteristic of DIP packaging used for integrated circuits?
A total of two rows of connecting pins placed on opposite sides of the package (Dual In-line Package)
Package mounts in a direct inverted position
Low leakage doubly insulated package
Two chips in each package (Dual In Package)
Why are high-power RF amplifier ICs and transistors sometimes mounted in ceramic packages?
Better dissipation of heat
High-voltage insulating ability
Enhanced sensitivity to light
To provide a low-pass frequency response
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