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Extra Class Exam Question Pool

effective 7/01/2016 thru 6/29/2020

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2016-E6E: Analog ICs: MMICs, CCDs, Device packages

2016-E6E01: Which of the following is true of a charge-coupled device (CCD)?

It samples an analog signal and passes it in stages from the input to the output

Its phase shift changes rapidly with frequency

It is a CMOS analog-to-digital converter

It is used in a battery charger circuit

2016-E6E02: Which of the following device packages is a through-hole type?



Ball grid array


2016-E6E03: Which of the following materials is likely to provide the highest frequency of operation when used in MMICs?

Gallium nitride


Silicon nitride

Silicon dioxide

2016-E6E04: Which is the most common input and output impedance of circuits that use MMICs?

50 ohms

300 ohms

450 ohms

10 ohms

2016-E6E05: Which of the following noise figure values is typical of a low-noise UHF preamplifier?

2 dB

-10 dB

44 dBm

-20 dBm

2016-E6E06: What characteristics of the MMIC make it a popular choice for VHF through microwave circuits?

Controlled gain, low noise figure, and constant input and output impedance over the specified frequency range

The ability to retrieve information from a single signal even in the presence of other strong signals

Plate current that is controlled by a control grid

Nearly infinite gain, very high input impedance, and very low output impedance

2016-E6E07: Which of the following is typically used to construct a MMIC-based microwave amplifier?

Microstrip construction

Ground-plane construction

Point-to-point construction

Wave-soldering construction

2016-E6E08: How is voltage from a power supply normally furnished to the most common type of monolithic microwave integrated circuit (MMIC)?

Through a resistor and/or RF choke connected to the amplifier output lead

MMICs require no operating bias

Through a capacitor and RF choke connected to the amplifier input lead

Directly to the bias voltage (VCC IN) lead

2016-E6E09: Which of the following component package types would be most suitable for use at frequencies above the HF range?

Surface mount


Axial lead

Radial lead

2016-E6E10: What is the packaging technique in which leadless components are soldered directly to circuit boards?

Surface mount

Direct soldering

Virtual lead mounting

Stripped lead

2016-E6E11: What is a characteristic of DIP packaging used for integrated circuits?

A total of two rows of connecting pins placed on opposite sides of the package (Dual In-line Package)

Package mounts in a direct inverted position

Low leakage doubly insulated package

Two chips in each package (Dual In Package)

2016-E6E12: Why are high-power RF amplifier ICs and transistors sometimes mounted in ceramic packages?

Better dissipation of heat

High-voltage insulating ability

Enhanced sensitivity to light

To provide a low-pass frequency response

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2016-E6D: Toroidal and Solenoidal Inductors: permeability, core material, selecting, winding; transformers; Piezoelectric devices
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2016-E6F: Optical components: photoconductive principles and effects, photovoltaic systems, optical couplers, optical sensors, and optoisolators; LCDs
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